Typically made from tungsten powder with a purity of no less than 99.95%, it features high density (19.35 g/cm³), low vapor pressure, low evaporation rate, and high-temperature resistance.
Place tungsten powder into a capsule and evacuate the capsule; perform the first densification via cold isostatic pressing (CIP) to form the first tungsten target blank.
Remove the capsule and conduct the second densification using induction sintering to produce the second tungsten target blank.
Finally, carry out the third densification through hot isostatic pressing (HIP) to form the final tungsten target.
Semiconductor Manufacturing: Used to form thin-film materials, such as diffusion barrier layers, adhesion layers, and electrodes for large-scale integrated circuit (LSI) memories.
Coating Preparation: Enhances the wear resistance of material surfaces; also used in optical devices to fabricate high-quality thin-film materials.
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