TFT-LCD
Gate/source-drain electrode materials:
Molybdenum (Mo) or molybdenum alloys (MoNb, MoTi) are used in the metal layers of TFT arrays, replacing traditional aluminum (Al) or chromium (Cr). Their advantages include:
Low resistance (5.3×10⁻⁸ Ω·m), which reduces signal delay.
Corrosion resistance: Resistant to etching solutions (such as phosphoric acid) to improve yield.
Adhesion: Strong bonding with glass substrates (SiO₂) to prevent peeling.
Typical structure: Mo/Al/Mo three-layer stack (molybdenum protects the aluminum layer and prevents Hillock protrusions).
OLED
Molybdenum thin films act as buffer layers for anodes (ITO), enhancing conductivity and interface stability.
Flexible OLED substrates: Molybdenum thin films are applied to flexible metal substrates, providing mechanical support and water-oxygen barrier properties.
Display panel manufacturing equipment
Sputtering targets: High-purity molybdenum targets (with a purity of 99.95% or higher) are used in magnetron sputtering coating to deposit TFT metal layers.
Heating elements: Molybdenum wires/molybdenum plates are used in the high-temperature baking process (300-500°C) before liquid crystal injection.
Light-shielding layer materials
Tungsten or tungsten alloys (such as W-Ti) are used as light-shielding films for photomasks, replacing chromium (Cr). Their advantages include:
Higher density (19.3 g/cm³), which reduces X-ray scattering (applied in EUV lithography).
Resistance to electron beam bombardment, extending the service life of photomasks.
We can provide customized production or manufacturing according to your drawings as per your requirements.
Our equipment capacity allows for batch ordering and production.
Our materials have higher purity. Each batch of materials undergoes a full inspection to ensure their consistency and stability.
Our production is more standardized, with more precise dimensions and longer service life of the products.
Our production cycle is shorter, enabling us to complete the order production more quickly.
Our products include: tungsten sputtering targets, molybdenum sputtering targets, glass melting electrodes, rotating targets, molybdenum rotating targets, and ion implanter parts.