Core of Form: Generally referring to thin tungsten plate-shaped products, they are an extension and refinement of tungsten plates. There is no absolute standard for the boundary between tungsten sheets and "tungsten plates" — the industry typically classifies products with thinner thickness (e.g., less than 1 mm or thinner) that prioritize dimensional accuracy and surface quality as "tungsten sheets".
Core Features: On the basis of inheriting all the excellent properties of tungsten (high density, high melting point, good thermal and electrical conductivity, radiation resistance), they particularly emphasize:
Extremely Thin Thickness: The thickness range can be from several micrometers (foils) to several millimeters.
High Dimensional Accuracy and Flatness: Possessing strict thickness tolerances and extremely low curvature (warpage).
Excellent Surface Quality: Mirror-level finish can be achieved through precision grinding and polishing.
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Manufacturing Processes: Starting with sintered tungsten blanks or thick tungsten plates, the core process is precision rolling (including hot rolling, warm rolling and cold rolling). For ultra-thin sheets or products with extremely high requirements, subsequent precision grinding, electrolytic polishing or Chemical Mechanical Polishing (CMP) are performed to achieve nanoscale surface roughness.
Product Forms:
Thickness: Ranging from the micrometer level (e.g., 0.05 mm, i.e., 50 μm) to the millimeter level (e.g., 3 mm).
Surface Conditions: Matte (as-rolled), bright (ground), and mirror-like (polished).
Shape: Wafers, square sheets, rectangular sheets, as well as complex precision parts formed by etching or wire cutting.
Purity: Ultra-high purity (e.g., 99.99% or higher) is crucial for semiconductor applications to reduce contamination.
Thickness and Tolerance: Strict thickness uniformity and minimal tolerance (up to ±0.001 mm).
Flatness and Warpage: Flatness is a key indicator for processes such as lithography and bonding.
Surface Roughness (Ra Value): Ranging from sub-micron to nanometer levels, selected based on specific applications.
Grain Structure: Fine-grain structure typically provides better mechanical properties and machinability.
Tungsten sheets are mainly used in high-tech fields requiring thin, planar and precision functional components.
Semiconductor and Microelectronics Industry (Core Application)
Semiconductor Chip Manufacturing: Used as substrates and heat sinks for semiconductor devices, especially for high-power LEDs, laser diodes and microwave devices, leveraging their high thermal conductivity to achieve efficient heat dissipation.
Process Components: Serving as backing plates for PVD (Physical Vapor Deposition) sputtering targets, or directly processed into heater substrates, baffles, etc., for thin-film deposition.
Packaging and Testing: Applied as thermal diffusion layers and support sheets in high-end chip packaging, as well as substrates for probe cards.
Medical and Radiation Shielding (Precision Shielding)
High-End Medical Equipment: Used to manufacture multi-leaf collimator blades requiring precise collimation and movement in devices such as CT scanners, PET-CT systems and linear accelerators. Tungsten sheets can be processed into extremely thin and parallel blades to achieve precise radiation beam shaping.
Portable Shielding: Fabricated into thin and lightweight shielding cases for personal dosimeters, liners for radioactive isotope containers, etc.
Electronic Vacuum and Electric Light Sources
Electronic Vacuum Devices: Used as electrodes, support sheets and heat sinks inside high-power microwave tubes, magnetrons and X-ray tubes.
Light Source Components: Serving as base materials for reflector cups (coated after polishing) in special halogen lamps and film projection lamps.
Precision Machining and Molds
EDM Electrodes: Thin-sheet electrodes used for precision micro-electrical discharge machining (micro-EDM), capable of processing narrow slots, micro-holes, etc.
Wear-Resistant Gaskets and Sealing Rings: Precision gaskets used in high-temperature and high-wear environments.
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