Xi'an Gemei Metal Material Co., Ltd.
Xi'an Gemei Metal Material Co., Ltd.

Molybdenum sheet generally refers to thin plate-shaped molybdenum material with a thickness of less than 1.0 mm, which is a sub-category of molybdenum sheet products characterized by precision and light weight. When the thickness is reduced to the "foil" range, its physical properties, processability and application scenarios will undergo significant changes, with the core application shifting from heavy-duty high-temperature structural support to functional fields such as precision electronic components, flexible sealing and composite substrates.

What is a Molybdenum Sheet?

  • Molybdenum sheet is a key form of molybdenum material evolving toward the direction of "light weight, thinness, precision and flexibility". It has successfully extended the extreme performance of molybdenum from the field of macroscopic heavy-duty structures to cutting-edge fields such as microelectronics, precision manufacturing and life sciences. If molybdenum sheet is regarded as the "armor and foundation" of high-temperature industries, then molybdenum foil is the "nerves and joints" in high-end equipment.


  • Certain room-temperature bendability: At specific thicknesses (e.g.,<0.5 mm) and conditions, it can undergo small-radius cold bending or forming, which is fundamentally different from the absolute brittleness of thick molybdenum sheets at room temperature.


  • Excellent planar heat dissipation capability: Its thin-sheet form makes it an efficient planar heat conduction and dissipation channel.


  • Strict requirements for high surface quality: As a functional layer or appearance component, it has extremely high requirements for surface finish, flatness and cleanliness.


  • Diversified processing methods: It can be subjected to precision processing such as photolithography, etching and stamping (which needs to be performed cautiously).

Molybdenum Sheet Types

Applications of Molybdenum Sheet

Semiconductor and Microelectronics Industry (Core Field)

  • Chip Carrying and Heat Dissipation: Serves as heat sink foils or substrates for high-power semiconductor devices (e.g., IGBTs) to rapidly conduct heat away from chips.

  • Sputtering Targets: Used in Physical Vapor Deposition (PVD) for fabricating thin-film circuits, display panel films, etc.

  • Lead Frame Materials: Applied in high-reliability electronic packaging, thanks to its well-matched coefficient of thermal expansion with chip materials such as silicon and gallium arsenide.


Electric Light Source and Vacuum Electronics Industry

  • High-performance Lamp Components: Such as core wire supports and conductive foils for halogen lamps and HID lamps, featuring high temperature resistance and non-deformation.

  • Electrodes for Vacuum Electronic Devices: Used as precision components including grids and anodes.

  • Magnetron Components: Utilized in vacuum tubes of equipment like microwave ovens.


High-temperature Furnaces and Heat Treatment Equipment (Precision Components)

  • Thin Heat Shield Layers: Employed as inner thin shields in multi-layer heat insulation structures.

  • Flexible High-temperature Gaskets: Can be processed into specific shapes for door seals of vacuum or protective atmosphere furnaces, etc.

  • Precision Sensor Protection Sleeves: Used to encase thermocouples and other components, providing corrosion and high temperature protection.


Medical Devices and Targeted Therapy

  • Collimator Blades for Cancer Radiotherapy: Taking advantage of its high density and excellent shielding performance against X-rays and γ-rays, it is fabricated into blades for multi-leaf collimators to precisely shape radiation beams.

  • Components for Medical Radiation Equipment.


Glass and Coating Industry

  • Mask Plates for Coating Processes: Used to shield specific areas during the coating of mobile phone screens, OLEDs, etc.

  • Laminates for Glass Molding Dies: Owing to its non-adhesion to high-temperature glass.


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